| Business Summary | | Kulicke
and
Soffa
Industries
Inc.
is
a
supplier
of
semiconductor
assembly
interconnect
equipment,
materials
and
technology.
Chip
and
wire
solutions
combine
wafer
dicing,
die
bonding
and
wire
bonding
equipment
with
saw
blades,
die
collets,
wire
and
capillaries.
Flip
chip
solutions
include
wafer
bumping
technology,
die
placement
equipment
and
Ultravia
high
density
substrates.
Chip
scale
and
wafer
level
packaging
solutions
include
solder
sphere
attachment
systems
and
Ultra
CSP
technology.
Test
interconnect
solutions
include
standard
and
vertical
probe
cards,
ATE
interface
assemblies
and
ATE
boards
for
wafer
testing,
and
test
sockets
and
contactors
for
all
types
of
packages.
The
Company
also
markets
factory
management
and
shop
floor
control
software. | More
from
Market Guide: Expanded
Business Description |
| Financial Summary | | KLIC
designs,
manufactures
and
markets
capital
equipment
and
packaging
materials
for
sale
to
companies
that
manufacture
and
assemble
semiconductor
devices.
KLIC
also
services,
maintains,
repairs
and
upgrades
assembly
equipment.
For
the
nine
months
ended
6/01,
revenues
fell
35%
to
$436.9
million.
Net
loss
totaled
$32.2
million,
vs.
an
income
of
$73
million.
Results
reflect
lower
sales
of
automatic
ball
bonders,
and
a
$11.7
million
purchased
research
and
development
charge. | More
from
Market Guide: Significant
Developments |
| | | | FY2000
Compensation | | Pay | Exer | |
| C. Scott Kulicke, 51 Chairman,
CEO | $1.1M | -- | Clifford Sprague, 57 CFO,
Sr. VP | 461K | $2.2M | Morton Perchick, 63 Exec.
VP | 636K | 3.3M | David Leonhardt, 42 Sr.
VP | 448K | 892K | Alexander Oscilowski, 41 Sr.
VP | -- | -- | Dollar
amounts are as of 30-Sep-2000 and compensation values are for the fiscal year ending on that date; "Pay" is salary, bonuses, etc.; "Exer" is the value of options excercised during the fiscal year. |
| More
from
Market Guide on Officers & Directors: Expanded
List, Bios,
Compensation,
Options
|
|