| Business Summary | | Ceramics
Process
Systems
Corporation
serves
the
wireless
communications
infrastructure
market,
high-performance
microprocessor
market,
motor
controller
market
and
other
microelectronic
markets
by
developing,
manufacturing
and
marketing
advanced
metal-matrix
composite
components
to
house,
interconnect
and
thermally
manage
microelectronic
devices.
The
Company's
products
are
typically
in
the
form
of
housings,
packages,
lids,
substrates,
thermal
planes
or
heat
sinks,
and
are
used
in
applications
where
thermal
management
and/or
weight
are
important
considerations.
The
Company's
products
are
manufactured
by
proprietary
processes
it
has
developed,
including
the
Quickset
Injection
Molding
Process
and
the
QuickCast
Pressure
Infiltration
Process. | More
from
Market Guide: Expanded
Business Description |
| Financial Summary | | Ceramics
Process
Systems
Corporation
develops,
manufactures,
and
markets
advanced
metal-matrix
composite
and
ceramic
components
used
to
house
and
interconnect
microelectronic
devices.
For
the
26
weeks
ended
6/30/01,
revenues
fell
33%
to
$1.8
million.
Net
loss
totalled
$538
thousand
vs.
an
income
of
$179
thousand.
Revenues
reflect
customer
delays
of
shipment
releases.
Net
loss
reflects
a
lower
gross
profit
margin
and
increased
sales
and
administrative
expenses. | More
from
Market Guide: Significant
Developments |
| | | | FY1999 Pay | |
| Grant Bennett, 45 Pres
CEO, Treasurer | $125K | Dollar amounts are as of 26-Dec-1999 and compensation values are for the fiscal year ending on that date; "Pay" is salary, bonuses, etc.. |
| More
from
Market Guide on Officers & Directors: Expanded
List, Bios,
Compensation,
Options
|
|