| Business Summary | | ChipPAC,
Inc.
is
a
provider
of
semiconductor
packaging,
test
and
distribution
test
services.
The
Company
offers
a
full
portfolio
of
leaded,
laminate
and
flip-chip
packaging
and
inter-connect
technologies
to
semiconductor
companies
that
service
the
communications,
computing
and
consumer
markets.
The
Company
also
provides
high-end
packaging
solutions,
including
ball-grid
array
packages,
an
advanced
mass-produced
type
of
package.
The
Company
also
provides
advanced
packaging
products
that
address
the
needs
of
semiconductors
used
in
wireless
and
wireline
communications
applications,
including
flip-chip,
chip-scale
and
stacked
die
technologies.
The
Company
offers
semiconductor
packaging
and
test
services
to
the
semiconductor
industry,
with
products
and
service
offerings
in
communications,
computing
and
multi-applications
end
markets. | More
from
Market Guide: Expanded
Business Description |
| Financial Summary | | ChipPAC,
Inc.
is
a
provider
of
semiconductor
packaging
and
test
services,
including
ball
grid
array
packages,
as
well
as
packaging
products
for
semiconductors
used
in
wireless
and
wireline
applications.
For
the
six
months
ended
6/30/01,
revenue
fell
14%
to
$177.2
million.
Net
loss
applicable
to
Common
totaled
$17.2
million,
vs.
an
income
of
$2.3
million.
Results
reflect
weak
demand
in
the
semiconductor
industry,
and
a
$3
million
charge
for
the
restructuring
of
the
company's
labor
force. | More
from
Market Guide: Significant
Developments |
| | | | FY2000 Pay | |
| Dennis McKenna, 51 Pres,
CEO, Chairman | $918K | Robert Krakauer, 34 Sr.
VP, CFO | 381K | Richard Freeman, 51 Sr.
VP, COO | -- | Patricia McCall, 46 Sr.
VP of Administation, Gen. Counsel, Sec. | -- | Gregory Bronzovic, 44 VP,
Worldwide Sales | 338K | Dollar amounts are as of 31-Dec-2000 and compensation values are for the fiscal year ending on that date; "Pay" is salary, bonuses, etc.. |
| More
from
Market Guide on Officers & Directors: Expanded
List, Bios,
Compensation,
Options
|
|