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  September 5, 2001
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Home > Company Index > Electronics & Misc. Technology > Semiconductor Equipment & Materials > ChipPAC, Inc.

ChipPAC, Inc.
Nasdaq: CHPC
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 NEWS FROM THE WIRES
ChipPAC reports Q2 net loss, sees further loss
Aug 02 2001 01:34 PM PDT

ChipPAC Q2 results
Aug 02 2001 01:10 PM PDT

CBOE lists three new options this week
Jul 20 2001 10:19 AM PDT

More WIRE STORIES about this company

 PROFILE
How many chips would ChipPAC package if ChipPAC packaged chips? The company packages semiconductors in protective cases that attach to printed circuit boards. It focuses on ball grid array packaging (56% of sales) and provides leaded packaging services to about 75 customers. ChipPAC also tests semiconductors and has expanded its functionality and reliability testing services by acquiring Intersil's Malaysian packaging and testing operations. Entities affiliated with Bain Capital and Citicorp Venture Capital own 31% and 23% of ChipPAC, respectively. Customers Hynix Semiconductor (formerly Hyundai Electronics Industries, of which ChipPAC was initially a division) and Intel also own stakes in the company.

 COMPETITION
ASE Test Limited (ASTSF)
Amkor Technology, Inc. (AMKR)
ST Assembly Test Services Ltd (STTS)

 DEALS
Deal: ChipPAC Raises $65 Million
Date Announced: 06.11.01
Value of transaction (US $Mil): 65
Description: Semiconductor testing and distribution company receives $65 million through private placement of stock.

 STOCK ANALYSIS
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FURTHER ANALYSIS
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 FINANCIAL OVERVIEW
Fiscal Year-End: December
2000 Sales (mil.): 494.40
1-Yr. Sales Growth: 31.7%
Employees: 6,753
Revenue per employee: $73,211.91

 KEY PEOPLE
• Dennis P. McKenna
    CEO
• Robert Krakauer
    CFO

 CONTACT INFO
3151 Coronado Dr.
Santa Clara, CA 95054
US
Phone: 408-486-5900
Fax: 408-486-5910
Online: Web Site

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