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  September 5, 2001
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Home > Company Index > Electronics & Misc. Technology > Semiconductor - Memory Chips > Dense-Pac Microsystems, Inc.

Dense-Pac Microsystems, Inc.
Nasdaq: DPAC
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 PROFILE
Dense-Pac's hot stacks don't need syrup. Dense-Pac Microsystems makes computer memory modules by stacking and connecting chips to provide more memory without taking up more board space. The durable ceramic and lightweight plastic modules are used in commercial (70% of sales), military, and aerospace systems such as portable telephones, medical instruments, and weapons. Dense-Pac targets electronic equipment manufacturers, deriving a significant portion of sales from custom designs, to which it retains the rights. Customers include Ericsson, Hyundai, Motorola, and NEC. The company sold its TypeHaus subsidiary, which makes memory chips for printers. Euroventures Benelux Team B.V. owns about 22% of Dense-Pac.

 COMPETITION
Aeroflex Incorporated (ARXX)
Integrated Device Technology, Inc. (IDTI)
Irvine Sensors Corporation (IRSN)

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 FINANCIAL OVERVIEW
Fiscal Year-End: February
2001 Sales (mil.): 35.80
1-Yr. Sales Growth: 30.2%
Employees: 106
Revenue per employee: $337,735.85

 KEY PEOPLE
• Ted G. Bruce
    CEO
• William M. Stowell
    CFO

 CONTACT INFO
7321 Lincoln Way
Garden Grove, CA 92841
US
Phone: 714-898-0007
Fax: 714-897-1772
Online: Web Site

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