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  September 5, 2001
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Home > Company Index > Electronics & Misc. Technology > Semiconductor Equipment & Materials > Integrated Packaging Assembly Corporation

Integrated Packaging Assembly Corporation
OTC: IPAC
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 PROFILE
When it comes to packaging chips, IPAC stops just short of wrapping them up with a bow. Semiconductor packager Integrated Packaging Assembly Corporation (IPAC) receives wafers from its customers, cuts the wafers into individual chips, adds wire leads, and encases each chip in protective plastic, ready for installation into such products as PCs, cars, cameras, and telecommunications equipment. IPAC touts its Silicon Valley location for enabling it to deliver finished products faster than many of its competitors, most of which are located in Asia. Customers include Atmel (32% of sales), Orbit Semiconductor, and Cirrus Logic. Taiwan-based chip maker Orient Semiconductor Electronics owns three-quarters of IPAC.

 COMPETITION
ASAT Holdings Limited (ASTT)
Amkor Technology, Inc. (AMKR)
ChipPAC, Inc. (CHPC)

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 FINANCIAL OVERVIEW
Fiscal Year-End: December
2000 Sales (mil.): 24.20
1-Yr. Sales Growth: 38.6%
Employees: 171
Revenue per employee: $141,520.47

 KEY PEOPLE
• Edmond Tseng
    CEO
• Vincent R. Lepore
    CFO

 CONTACT INFO
2221 Old Oakland Rd.
San Jose, CA 95131
US
Phone: 408-321-3600
Fax: 408-321-3603
Online: Web Site

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