| Business Summary | | OSE
USA,
Inc.,
formerly
Integrated
Packaging
Assembly
Corp.,
is
a
semiconductor-packaging
foundry
that
receives
wafers
from
its
customers
and
assembles
each
integrated
circuit
in
a
protective
plastic
package.
The
Company's
packaging
facilities
are
located
in
San
Jose,
California,
in
close
proximity
to
its
customers
and
the
end
users
of
its
customers'
products.
The
Company's
close
proximity
to
its
customers
promotes
quicker
turnaround
design,
prototype
production
and
final
product
delivery.
The
Company
is
also
the
exclusive
North
American
sales
and
marketing
organization
for
Orient
Semiconductor
Electronics,
Ltd.
(OSE)
of
Taiwan,
a
public
Taiwanese
company.
Revenues
are
derived
from
fees
received
on
the
sales
of
OSE's
semiconductor
assembly
and
test
services
to
customers
headquartered
in
North
America.
The
Company
has
focused
on
packages
designed
for
assembly
using
Surface
Mount
Technology,
in
which
leads
on
integrated
circuits
are
soldered
to
the
surface
of
the
printed
circuit
board. | More
from
Market Guide: Expanded
Business Description |
| Financial Summary | | OSE
USA,
Inc.
is
an
independent
semiconductor
packaging
foundry.
The
Company
assembles
and
packages
integrated
circuits
from
wafers
consigned
by
its
customers.
For
the
six
months
ended
7/1/01,
revenues
fell
52%
to
$6.8
million.
Net
loss
applicable
to
Common
rose
15%
to
$4.6
million.
Revenues
reflect
a
decrease
in
orders
as
a
result
of
the
general
slowdown
in
the
semiconductor
industry.
Higher
loss
reflects
lower
margins. | More
from
Market Guide: Significant
Developments |
| Officers | | | FY2000 Pay | |
| Edmond Tseng, 54 Chairman,
Pres, CEO | $374K | Gerald Fehr, 63 Exec.
VP and CTO | 221K | Chris Ooi, 46 VP-Operations | 188K | Vincent Lepore, 61 Controller,
CAO | -- | Dollar amounts are as of 31-Dec-2000 and compensation values are for the fiscal year ending on that date; "Pay" is salary, bonuses, etc.. |
| More
from
Market Guide on Officers & Directors: Expanded
List, Bios,
Compensation,
Options
|
|