| Business Summary | | BE
Semiconductor
Industries
N.V.
is
a
supplier
of
packaging
and
plating
equipment
to
the
semiconductor
industry.
The
Company
designs
and
manufactures
technologically
advanced,
high-performance
equipment
and
integrated
systems
for
the
semiconductor
industry's
assembly
process.
The
Company's
equipment
is
used
primarily
to
produce
semiconductor
packages,
which
provide
the
electronic
interface
and
physical
connection
between
the
chip
and
other
electronic
components
and
protect
the
chip
from
the
external
environment.
The
Company
operates
through
two
wholly
owned
subsidiaries
and
a
joint
venture
in
which
it
maintains
a
30%
interest.
The
Company's
Fico
B.V.
subsidiary
provides
automated
molding
and
trim
and
form
systems.
Its
Meco
International
B.V.
subsidiary
provides
automated
plating
and
singulation
equipment.
Its
Possehl
BESI
Electronics
N.V.
joint
venture
provides
leadframes
and
connector
plating
services. | More
from
Market Guide: Expanded
Business Description |
| Financial Summary | | BESI
designs,
develops,
manufactures,
markets
and
services
automated
molding,
trim
and
form,
and
selective
plating
and
tin-lead
plating
equipment
and
integrated
lines
for
semiconductor
chip
production.
For
the
three
months
ended
3/31/01,
sales
rose
43%
to
EUR54M.
Net
income
totaled
EUR5.1
million,
up
from
EUR2.3
million.
Revenues
reflect
strong
customer
acceptance
and
increased
market
share.
Earnings
also
benefitted
from
increased
manufacturing
efficiencies. | More
from
Market Guide: Significant
Developments |
| Officers | |
| Position | Frank Stangenberg-Haverkamp, 51 | Chairman
of the Supervisory Board | Richard Blickman, 46 | Pres,
CEO and Chairman of the BESI Management Board | Jorg Rischke, 56 | Managing
Director of Plating Systems and Chemicals | Michiel Van Schaik, 48 | Managing
Director of Fico | Jan Dil, 50 | Gen.
Mang. of Trim and Form |
| More
from
Market Guide on Officers & Directors: Expanded
List, Bios,
Compensation,
Options
|
|