| | Business Summary | | DPAC
Technologies
Corp.,
formerly
known
as
Dense-Pac
Microsystems,
Inc.,
and
its
wholly
owned
subsidiaries
comprise
a
technology
company
that
provides
high-density
electronic
design
and
manufacturing
solutions
using
its
proprietary,
patented,
three-dimensional
packaging.
High-density
design
and
manufacturing
allows
customers
to
meet
their
electronic
system
performance
and
time-to-market
objectives
for
maximum
system
integration.
The
Company's
products
are
used
in
applications
such
as
network
servers,
computer
storage
devices,
medical
instrumentation
and
communication
electronics. | | More
from
Market Guide: Expanded
Business Description |
| | Financial Summary | | DPAC
designs
and
manufactures
proprietary
and
patented
three-dimensional
higher
density
memory
products
that
enable
commercial,
industrial
and
military
customers
to
stack
large
amounts
of
memory
into
small
spaces.
For
the
three
months
ended
5/31/01,
revenues
decreased
32%
to
$7.5
million.
Net
income
decreased
91%
to
$111
thousand.
Revenues
reflect
a
decrease
in
sales
of
high-density
commercial
products.
Net
income
also
reflects
the
addition
of
new
personnel. | | More
from
Market Guide: Significant
Developments |
| | | | FY2001
Compensation | | Pay | Exer | |
| Richard Dadamo, 73
Chairman | $185K | -- | Ted Bruce, 43
Pres,
CEO | 260K | $409K | John Sprint, 39
COO | 189K | 473K | William Stowell, 45
VP
of Fin. and CFO | 180K | 411K | | Dollar
amounts are as of 28-Feb-2001 and compensation values are for the fiscal year ending on that date; "Pay" is salary, bonuses, etc.; "Exer" is the value of options excercised during the fiscal year. |
| More
from
Market Guide on Officers & Directors:
Expanded
List, Bios,
Compensation,
Options
|
|
![[one-year price graph]](http://chart.yahoo.com/c/0b/d/dpac.gif)