improve it or discuss these issues on the talk page . learn how and when to remove these template messages this article contains content that is written like an advertisement . please help improve it by removing promotional content and inappropriate external links and by adding encyclopedic content written from a neutral point of view . july 2013 learn how and when to remove this template message this article needs to be updated . please update this article to reflect recent events or newly available information . april 2015 learn how and when to remove this template message globalfoundries inc. type subsidiary industry semiconductor foundry founded march 2 2009 ; 7 years ago 2009 03 02 headquarters santa clara california u.s. key people sanjay jha ceo products silicon wafers revenue us 5 billion 2015 1 number of employees 18 000 2 parent atic website www.globalfoundries.com globalfoundries stylized as globalfoundries is a semiconductor foundry headquartered in santa clara california . 3 globalfoundries was created by the divestiture of the manufacturing arm of advanced micro devices amd on march 2 2009 expanded through the acquisition of chartered semiconductor on january 23 2010 and further expanded through the acquisition of ibm microelectronics on july 1 2015 . the emirate of abu dhabi is the owner of the company through its subsidiary advanced technology investment company atic . on march 4 2012 amd announced they divested their final 14 % stake in the company which concluded amd s multi year plan to divest its manufacturing arm . 4 the firm manufactures integrated circuits in high volume mostly for semiconductor companies such as amd broadcom qualcomm and stmicroelectronics . it has five 200 mm wafer fabrication plants in singapore one 300 mm fabrication plant in each of germany and singapore and three fabrication plants in the united states one 200 mm fabrication plant in vermont and two 300 mm fabrication plants in new york . 5 sanjay jha is the chief executive officer ceo of globalfoundries . 6 contents 1 overview 2 fabrication facilities 2.1 300 mm fabrication facilities 2.1.1 fab 1 2.1.2 fab 7 2.1.3 fab 8 2.1.4 fab 10 2.2 200 mm fabrication facilities 2.2.1 fab 2 2.2.2 fab 3 5 2.2.3 fab 3e 2.2.4 fab 6 2.2.5 fab 9 3 mergers and acquisitions 3.1 merger with chartered semiconductor 3.2 acquisition of ibm s chip manufacturing unit 4 see also 5 references 6 external links overview edit as of 2015 the firm owned ten fabrication plants . fab 1 is in dresden germany . fabs 2 through 7 are in singapore . fabs 8 through 10 are in the northeast united states . these sites are supported by a global network of r & d design enablement and customer support in singapore china taiwan japan the united states germany and the united kingdom . 7 fabrication facilities edit 300 mm fabrication facilities edit globalfoundries fab 1 in dresden fab 1 edit fab 1 located in dresden germany is a 364 512 m plant which was transferred to globalfoundries on its inception fab 36 and fab 38 were renamed module 1 and module 2 respectively . each module can produce 25 000 300 mm diameter wafers per month . 5 8 module 1 is a 300 mm wafer production facility . it is capable of manufacturing wafers at 65 nm and 45 nm for use in amd cpus apus 32 nm soi hkmg silicon 28 nm polysion hkmg cpus apus and future 22 nm fdsoi . module 2 was originally named amd fab 30 and was a 200 mm fab producing 30 000 wafer outs per month wopm but has now been converted into a 300 mm wafer fab . together they have a maximum full capacity of 80 000 of 300 mm wafers month . 180 000 200 mm wafers month equivalent using technologies of 45 nm and below . in september 2016 globalfoundries announced fab 1 would be refit to produce 12 nm fully depleted silicon on insulator products . 9 the company expected customer s products would begin to tape out in the first half of 2019 . fab 7 edit fab 7 located in singapore is an operational 300 mm fab originally owned by chartered semiconductor . it produces wafers at 130 nm to 40 nm on bulk cmos and soi processes . it has a maximum full capacity of 50 000 300 mm wafers month 112 500 200 mm wafers month equivalent using 130 to 40 nm technology . 5 fab 8 edit fab 8 located in luther forest technology campus saratoga county new york united states is a new 300 mm fab . this fabrication plant was constructed by gf as a green field fab for advanced technologies . it is capable of manufacturing 14 nm node technology . the plant s construction began in july 2009 and the company started mass production in 2012 . 5 10 it has a maximum manufacturing capacity of 60k 300 mm wafers month or the equivalent of over 135k 200 mm wafers month . in september 2016 globalfoundries announced it would make a multibillion dollar investment to refit fab 8 to produce 7 nm finfet parts starting in the second half of 2018 . 11 the process is planned to initially use deep ultraviolet lithography and eventually transition to extreme ultraviolet lithography . 12 technology 28 nm and 14 nm . 7 nm planned . fab 10 edit fab 10 13 located in east fishkill new york usa was previously known as ibm building 323 . it became part of globalfoundries operations with the acquisition of ibm microelectronics . it currently manufactures technology down to the 22 nm node . 200 mm fabrication facilities edit all 200 mm fabs except fab 9 are located in singapore and originally owned by chartered semiconductor . fab 2 edit fab 2 is located at singapore capable of manufacturing wafers at 600 to 350 nm for use in selected automotive ic products high voltage power management ic and mixed signal products . fab 3 5 edit fab 3 5 is capable of manufacturing wafers at 350 to 180 nm for use in high voltage ic s for small panel display drivers and mobile power management modules . fab 3e edit fab 3e produces 180 nm wafers for use in selected automotive ic products high voltage power management ic and mixed signal products with embedded non volatile memory technology . fab 6 edit fab 6 is a full copper fab that is capable of highly integrated cmos and rfcmos products for applications such as wi fi bluetooth at 180 to 110 nm processes . fab 9 edit fab 9 13 located in essex junction vermont usa near burlington vermont became part of globalfoundries operations with the acquisition of ibm microelectronics . the fab manufactures technologies down to the 90 nm node . the site also hosts a captive mask shop with development efforts down to the 7 nanometer node . mergers and acquisitions edit merger with chartered semiconductor edit the majority investor of globalfoundries abu dhabi s advanced technology investment co. announced on september 6 2009 that it has agreed to acquire singapore based chartered semiconductor manufacturing co. ltd. for a total of 3.9 billion with chartered s operations being folded into globalfoundries . 14 chartered semiconductor is a member of the common platform ibm s semiconductor technology alliance . globalfoundries is a jda partner of common platform technology alliance . acquisition of ibm s chip manufacturing unit edit in october 2014 globalfoundries received us 1.5 billion from ibm to accept taking over ibm s chip manufacturing business unit including a 200 mm fab now fab 9 in essex junction vermont and a 300 mm fab now fab 10 in east fishkill new york . as part of the agreement globalfoundries will be the sole provider of ibm s server processor chips for the next 10 years . the deal closed on july 1 2015 . 15 see also edit list of semiconductor fabrication plants references edit top 10 semiconductor companies 2015 . november 11 2015 . retrieved december 4 2015 . globalfoundries fast facts . retrieved 6 august 2015 . by nathan donato weinstein silicon valley business journal . globalfoundries moving hq to santa clara leases 165k sq. ft. building . march 12 2013 . retrieved may 2 2016 . shimpi anand lal . globalfoundries granted independence acquires remaining stake from amd . anandtech . retrieved 8 december 2012 . a b c d manufacturing . retrieved 6 august 2015 . globalfoundries hires mobile industry veteran sanjay jha as ceo . bloomberg.com . 7 january 2014 . globalfoundries unveils industry s first 28nm signoff ready digital design flows press release . 13 january 2011 . 404 . retrieved 6 august 2015 . kampman jeff 8 september 2016 . globalfoundries adds a 12 nm node to its fd soi roadmap . techreport . retrieved 16 september 2016 . globalfoundries saratoga county new york usa archived 10 march 2009 at the wayback machine . shilov anton 3 october 2016 . globalfoundaries updates roadmap . anandtech . retrieved 3 october 2016 . kampman jeff 15 september 2016 . globalfoundries skips the 10 nm node on the way to 7 nm finfets . techreport . retrieved 16 september 2016 . a b jim doyle . retrieved 6 august 2015 . bolaji ojo ee times . atic to buy fold chartered into globalfoundries . september 7 2009 . retrieved august 10 2015 . by alex barinka and alan king bloomberg . ibm to pay globalfoundries 1.5 billion to take chip unit . october 20 2014 . retrieved august 10 2015 . external links edit wikimedia commons has media related to globalfoundries . globalfoundries official web site chip plant to hide use of taxpayer funds v t e major information technology companies largest it companies largest internet companies largest software companies semiconductor sales leaders by year consulting and outsourcing accenture atos booz allen hamilton bt global services caci capgemini cgi group cognizant computer sciences corporation deloitte digital china fujitsu hcl technologies hitachi consulting hewlett packard enterprise services ibm global services indra sistemas infosys kpmg leidos nec ntt data orange business services t systems tata consultancy services tech mahindra unisys wipro imaging canon inc. hp inc. eastman kodak fujifilm konica minolta kyocera lexmark nikon olympus corporation panasonic ricoh samsung electronics seiko epson sharp sony 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