industry semiconductor founder karl suss headquarters garching near munich germany area served worldwide key people dr. per ove hansson president & ceo michael knopp cfo walter braun coo products mask aligner coater wafer bonder revenue 145.3 million fy 2014 number of employees 659 fy 2014 website www.suss.com s ss microtec ag is a supplier of equipment and process solutions for the semiconductor industry and related markets . the high precision microstructuring systems like photolithography tools are used for manufacturing of processors memory chips mems led and other micro system devices . suss microtec is headquartered in garching bei m nchen germany . contents 1 history 2 organization 3 products 3.1 photomask processing equipment 3.2 mask aligner photolithographic alignment tool 3.3 coater 3.4 wafer bonder bond equipment 3.5 microlens arrays micro optical devices 4 former ceos 5 alliances 6 external links 7 references history edit in 1949 karl s ss founded the company karl s ss kg to support sales and service for optical devices made by ernst leitz gmbh later leica in munich germany . then in 1963 the assignment by siemens to develop a simple photolithography tool marked a change in the strategic direction of the company towards contract manufacturing and engineering . with the creation of the mjb3 the first mask aligner now exhibited in the deutsches museum in munich the company entered the emerging semiconductor industry . in addition to manual and automatic alignment equipment the product portfolio extended to systems for related wafer processing steps such as development cleaning and wafer bonding . the company expanded into the global market with the foundation of its first overseas subsidiaries in the 1980s . in 1999 under the holding s ss microtec ag the suss group went public on the german stock exchange . in 2002 all subsidiaries were renamed suss microtec . organization edit in 1980 a production site for wafer bonders was founded in waterbury vermont us and in 1989 a production site opened for test systems in sacka near dresden germany . the acquisition of the french company s.e.t. in 1993 complemented the product portfolio with spin coaters and device bonders the latter product line was phased out in 2007 . with the acquisition of image technology in palo alto california us high precision photomasks were provided for the lithographic processes . in 2002 the foundation of suss microoptics in neuchatel switzerland brought forward wafer level produced optical devices such as micro lenses . with the sale of the test systems division and the purchase of hamatech ape early in 2010 suss microtec not only expands its expertise in wet processes but further focuses its core competence on micro structuring of devices . in 2012 suss microtec acquires tamarack scientific co. inc. . tamarack develops manufactures and distributes uv projection lithography systems as well as laser micro structuring tools for the advanced packaging 3d integration mems and led markets . the company has sales offices in the semiconductor markets of japan taiwan china singapore und korea . products edit photomask processing equipment edit photomasks can be very expensive with up to several hundred thousands of us dollars . thus cleaning photomasks is very important in the areas of lithography and mask manufacturing . photomask processing equipment comprises post exposure bake develop strip and clean . mask aligner photolithographic alignment tool edit mask aligners adjust a glass mask to a wafer with submicron precision . this is vital for the exposure process with which the microscopic picture on the glass mask is then transferred to the wafer . the suss microtec mask aligner also covers other process steps for wafer processing such as development of the resists and cleaning of the photo mask . coater edit coaters distribute photo sensitive resists onto the wafer . for this process various technologies and equipment can be used spin coater using centrifugal forces or spray coater that allow for an even distribution of the resist also on three dimensional structures . wafer bonder bond equipment edit wafer bonders join two or more aligned substrates to create an integrated circuit . the substrates can be joined or bonded using the following techniques fusion bonding anodic bonding eutectic bonding solder bonding glass frit bonding adhesive bonding . temporary wafer bonding is performed on thinned wafers that are placed on a carrier for support . it gets its name because the adhesive used for bonding is removed . this process is used mainly to manufacture 3d integrated circuits . suss microtec produces equipment that supports all of these bonding techniques . microlens arrays micro optical devices edit the microlens arrays manufactured by suss microtec s subsidiary suss microoptics are produced on wafer level and are used for a large variety of applications such as illumination systems for semiconductor industry telecommunication metrology imaging and laser industry . former ceos edit frank p. averdung and dr. per ove hansson were hired from outside the group . former ceos include dr. franz richter dr. stefan schneidewind frank p. averdung and dr. per ove hansson alliances edit suss microtec announced in 2009 a range of strategic partnerships with industry partners as well as leading research institutes such as imec and itri in the field of 3d integration . suss microtec partnered with philips research for developing nanoimprint lithography processes . external links edit company website references edit deutsche b rse germann stock exchange press releases vlsi supplier ranking suss microtec a 3d approach advanced mask aligner lithography new illumination system v t e tecdax companies of germany updated 18.03.2013 adva optical networking aixtron bb biotech bechtle cancom ag carl zeiss meditec dialog semiconductor dr gerwerk drillisch euromicron evotec freenet ag jenoptik kontron lpkf laser & electronics morphosys nordex se pfeiffer vacuum psi ag qiagen qsc ag sartorius ag sma solar technology software ag stratec biomedical systems s ss microtec telef nica germany united internet wirecard xing retrieved from https en.wikipedia.org w index.php title suss microtec & oldid 736730267 categories equipment semiconductor companiescompanies based in bavaria navigation menu personal tools not logged intalkcontributionscreate accountlog in namespaces article talk variants views read edit view history more search navigation main pagecontentsfeatured contentcurrent eventsrandom articledonate to wikipediawikipedia store interaction helpabout wikipediacommunity portalrecent changescontact page tools what links hererelated changesupload filespecial pagespermanent linkpage informationwikidata itemcite this page print export create a bookdownload as pdfprintable version languages deutsch edit links this page was last modified on 29 august 2016 at 13 20 . text is available under the creative 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