nyse asx industry semiconductor assembly testing & packaging founded 1984 founders jason chang richard chang headquarters kaohsiung taiwan area served worldwide revenue usd 8.72 billion 2015 number of employees 65 695 website www.aseglobal.com en advanced semiconductor engineering inc. also known as ase group is a taiwan based provider of independent semiconductor assembling and test manufacturing services with its headquarters in kaohsiung taiwan . 1 contents 1 overview 2 technology 3 facilities 4 references overview edit the company was founded in 1984 by brothers jason chang and richard chang who opened its first factory in kaohsiung taiwan . 2 jason chang currently serves as company chairman and is on the 2016 forbes list of the world s billionaires . 3 as of april 1 2016 the company s market cap was usd 8.77 billion . 4 in may 2015 ase group entered into an agreement with tdk to establish a joint venture company in kaohsiung taiwan named ase embedded electronics inc. the company manufactures ic embedded substrates utilizing tdk s sesub technology . 5 technology edit according to the market research firm gartner ase is the largest outsourced semiconductor assembly and test osat provider with 19 percent market share . 6 the company offers services such as semiconductor assembly packaging and testing . 7 ase provides semiconductor assembly and testing services for over 90 percent of electronics companies in the world . 8 the packaging services include fan out wafer level packaging fo wlp wafer level chip scale packaging wl csp flip chip 2.5 d and 3d packaging system in package sip and copper wire bonding . 7 9 fan out wafer level packaging fo wlp a process that enables ultra thin high density packages has been around for several years and the fan out technology is becoming an industry trend due to increasing market demand for smaller and thinner mobile products . according to the research firm yole d veloppement the fan out packaging market is predicted to reach 2.4 billion by 2020 increasing from 174 million in 2014 . 10 wafer level chip scale packaging wl csp is the technology that enables the smallest available packages in the market meeting the increasing demand for smaller and faster portable consumer devices . this ultra thin package type has integrated into mobile devices such as smartphones . 10 in october 2001 ase began volume production of wafer level chip scale packages . 11 flip chip is a method of flipping over the chip to connect with either substrate or leadframe . 12 according to the research firm yole d veloppement the flip chip technology market value is expected to reach 25 billion in 2020 . this market trend is mainly driven by mobile and wireless devices like tablets computing applications such as servers and consumer applications like smart tvs . 13 2.5 d packaging can enable hundreds of thousands of interconnects within a small package space . 14 this packaging technology is used in applications such as high memory bandwidth network switches router chips 14 and graphics cards for the gaming market . 15 since 2007 ase has been working with amd to bring 2.5 d packaging technology to market . 15 the two companies collaborated on fiji a 2.5 d based gpu processor designed for extreme gamers which is small enough to fit a 6 inch pcb and connects 240 000 bumps . 16 in june 2015 fiji was officially launched at the e3 gaming conference . 17 system in package sip is the technology for bundling multiple ics to work together inside a single package . 18 sip technology is being driven by market application trends in wearables mobile devices and internet of things iot . 19 20 in 2004 ase was one of the first companies to begin mass production of sip technology . 21 in april 2015 the company planned to double its sip production capacity in the next 3 years . 20 facilities edit the company s main operations are in kaohsiung taiwan with other plants located in china south korea japan malaysia and singapore . it also has offices and service centers in china south korea japan singapore belgium and the united states . 22 on october 1 2013 a water incident occurred at the ase k7 facility . 23 in february 2014 officials from the kaohsiung city government and the kaohsiung environmental protection bureau epb visited the k7 factory to evaluate the resumption of operations at the facility . 24 in december 2014 after checking the company s improvement on wastewater treatment the epb officials agreed to allow the k7 facility to resume operations . 25 from 2010 to 2013 ase invested 25.3 million to build a water recycling plant k14 in kaohsiung taiwan . the k14 water treatment facility would process wastewater collected from ase plants . 26 references edit cnn money . advanced semiconductor engineering inc. may 12 2016 . milestones . aseglobal . retrieved 12 october 2015 . russell flannery . jason chang . forbes . yahoo finance . advanced semiconductor engineering inc. asx . retrieved april 1 2016 . by mark lapedus semiconductor engineering . the week in review manufacturing . may 8 2015 . retrieved august 18 2016 . ed sperling semiconductor engineering . foundries versus osats . jul 24 2014 . retrieved may 19 2016 . a b yahoo finance . ase . retrieved may 19 2016 . by ding yining shanghaidaily.com . ase set to spend us 4b to lift income . september 22 2011 . retrieved august 18 2016 . idc . what s next for semiconductor packaging . retrieved may 19 2016 . a b mark lapedus semiconductor engineering . fan out packaging gains steam . nov 23 2015 . retrieved may 31 2016 . edn . ase ramps wafer level csp production . oct 12 2001 . retrieved may 31 2016 . darvin edwards electronic design . package interconnects can make or break performance . sep 14 2012 . retrieved jun 6 2016 . i micronews . flip chip technologies and markets trends . sep 2015 . retrieved jun 6 2016 . a b rick merritt eet asia . semicon west highlights 10 chip trends . jul 21 2015 . retrieved jun 6 2016 . a b ed sperling semiconductor engineering . is the 2.5 d supply chain ready . sep 28 2015 . retrieved jun 6 2016 . mark lapedus semiconductor engineering . the week in review manufacturing . jul 17 2015 . retrieved jun 6 2016 . francoise von trapp 3dincites . at amd die stacking hits the big time . jul 22 2015 . retrieved jun 6 2016 . semiconductor engineering . system in package . retrieved jun 13 2016 . ed sperling semiconductor engineering . why packaging matters . nov 19 2015 . retrieved jun 13 2016 . a b ken liu cens . ase to invest us 100 200 bn . to double sip capacity over three years . apr 15 2015 . retrieved jun 13 2016 . roger allan electronic design . sip really packs it in . nov 29 2004 . retrieved jun 13 2016 . nasdaq . asx . retrieved jul 5 2016 . jason pan taipei times . court reverses verdict in ase pollution case . sep 30 2015 . retrieved jul 5 2016 . kathryn chiu the china post . officials to review resumption of ase k7 factory . feb 14 2014 . retrieved jul 5 2016 . chen ja fo jackson chang and scully hsiao taiwan news . ase kaohsiung plant to resume full operations soon . dec 15 2014 . retrieved jul 5 2016 . chiu yu tzu zdnet . ase chair s apology for water pollution delivered . dec 17 2013 . retrieved jul 5 2016 . this taiwan related article is a stub . you can help wikipedia by expanding it . v t e retrieved from https en.wikipedia.org w index.php title ase group & oldid 737453956 categories companies of taiwancompanies established in 1984assembly and test semiconductor companiestaiwan stubshidden categories all stub articles navigation menu personal tools not logged intalkcontributionscreate accountlog in namespaces article talk variants views read edit view history more search navigation main pagecontentsfeatured contentcurrent eventsrandom articledonate to wikipediawikipedia store interaction helpabout wikipediacommunity portalrecent changescontact page tools what links hererelated changesupload filespecial pagespermanent linkpage informationwikidata 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