overview flex via drilling circuit packaging high density interconnect automation semiconductor manufacturing semiconductor manufacturing overview scribing grooving memory repair wafer mark laser processing laser processing overview laser ablation micromachining milling passive component manufacturing passive component manufacturing overview mlcc testing resistor trimming wafer trimming tooling and consumables applications via drilling via drilling overview flex via drilling ic packaging high density interconnect semiconductor manufacturing semiconductor manufacturing overview wafer scribe wafer mark memory repair laser processing laser processing overview ablation cutting depaneling drilling engraving marking subsurface marking passive component manufacturing passive component manufacturing overview mlcc testing resistor trimming wafer trimming products via drilling via drilling overview flex interconnect gemstone 5335 flex5335 5335xi circuit packaging cornerstone high density interconnect nviant automation rollmaster semiconductor manufacturing semiconductor manufacturing overview scribing grooving ultrus memory repair 9850tpir wafer mark wafermark sigmaclean 300 wafermark sigmadsc laser processing laser processing overview laser ablation nwr193 nwr213 nwr266 nwrfemto uc mir 10 micromachining garnet jade lumen milling micromill passive component manufacturing passive component manufacturing overview mlcc testing 3510a 3500a resistor trimming lt2200 lt2210 lt3100 lt3110 wafer trimming m350 tooling and consumables machine tooling carrier plates belts about esi about esi overview locations news our team careers support & services support & services overview support offerings support locations compliance programs spare parts policies contact support prototype & production for investors see what it s like to be an esi customer contact an esi sales expert today knowledge thought leadership resources solutions via drilling flex via drilling circuit packaging high density interconnect automation semiconductor manufacturing scribing grooving memory repair wafer mark laser processing laser ablation micromachining milling passive component manufacturing mlcc testing resistor trimming wafer trimming tooling and consumables applications via drilling flex via drilling ic packaging high density interconnect semiconductor manufacturing wafer scribe wafer mark memory repair laser processing ablation cutting depaneling drilling engraving marking subsurface marking passive component manufacturing mlcc testing resistor trimming wafer trimming products via drilling flex interconnect gemstone 5335 flex5335 5335xi circuit packaging cornerstone high density interconnect nviant automation rollmaster semiconductor manufacturing scribing grooving ultrus memory repair 9850tpir wafer mark wafermark sigmaclean 300 wafermark sigmadsc laser processing laser ablation nwr193 nwr213 nwr266 nwrfemto uc mir 10 micromachining garnet jade lumen milling micromill passive component manufacturing mlcc testing 3510a 3500a resistor trimming lt2200 lt2210 lt3100 lt3110 wafer trimming m350 tooling and consumables machine tooling carrier plates belts utiity pages about esi locations news our team careers contact us support & services support offerings support locations compliance programs spare parts policies prototype & production contact support for investors search esi has been helping customers drive innovation for 70 years . how can we help you i have a sales question i need product specifications i need product support i have a general request build what s next your customers are demanding higherprecision shorter ramp times andmore flexible product lines . get your guide to laser micromachining precision in motion the nviant hdi microvia drilling solution engineered for affordability reliability and accuracy at high volume . learn more capitalize on innovation can you stay competitive if you can t fully leverage innovation learn about precision and accuracy missing out on flex pcb orders be prepared for the demands of flex pcb laser processing . download your free esi guide to adding flex laser processing part i pcb fabrication and substrate processing laser via drilling solutions to drive innovation and maintain your competitive advantage . meet the requirements for smaller microvias and higher feature density for flex pcb processing hdi manufacturing and ic packaging . semiconductor manufacturing wafer processing solutions that enable you to maintain high volume production even when incorporating new materials such as low k dialectrics and thin wafers without sacrificing yield . wafer scribing dicing marking and memory repair . laser processing esi delivers adaptable laser micromachining platforms to transform a wide range of materials and a series of laser ablation systems for material characterization . passive component manufacturing a family of solutions that address evolving challenges in surface mount component manufacturing and testing . a legacy of leadership in production oriented mlcc testing and laser based thick and thin film circuit trimming . precision & accuracy world class support lower cost of ownership the system that fits global service built to last the world is transforming . esi is focused on delivering new and innovative micro manufacturing solutions that empower our customers to build the products that transform lives . the development of this new technique provides our customers the ability to generate data across the periodic table at detection limits superior to traditional methods in a very cost effective manner . jon landau vice president of the geoanalytical division bureau veritas minerals for industries facing material transformation challenges in production esi applies unique process and engineering expertise to deliver a set of laser based solutions that extend our customers processing capabilities beyond the limitations of mechanical . see what it s like to be an esi customer contact an esi sales expert today solutions via drilling semiconductor manufacturing laser processing passive component manufacturing automation tooling and consumables support & services support & services support offerings support locations compliance programs spare parts policies prototype & production services contact support get the latest industry news & information subscribe to our free email newsletter the esi newsletter offers valuable insights into developments in laser processes and materials handling plus all the latest industry news and events . stay up to date with what s happening in the laser manufacturing industry ; subscribe today 2016 electro scientific industries inc. all rights reserved . privacy policy locations media resources careers for investors contact site map connect with us on linkedin