sensor packaging solutions amkor technology is the world s leader in mems packaging technologies and the world s largest outsource provider of mems and sensors . amkor offers a variety of modeling and characterization expertise to complement a proven high volume manufacturing hvm capability . this combination uniquely positions amkor to assist customers quickly through the development phase and into hvm with new applications . amkor currently has mems & sensor manufacturing in our korea taiwan and philippines factories . more ... sip packaging solutions by assembling testing and shipping more than one million sip devices per day amkor technology has a proven track record as the industry leader in sip design assembly and test . similar to a system on chip soc approach amkor s sip technology is an ideal solution in markets that demand smaller size with increased functionality . however sip has the added benefit of compatibility with die design changes and integration of various die technologies e.g. si gaas sige soi mems without the high cost and lead time associated with soc development and manufacturing . more ... stay up to date on amkor technology via email and social media amkor technology now offers multiple ways to stay updated about our products services and technology offerings as well as upcoming industry conferences that we may be presenting and or exhibiting at . stay connected to amkor by subscribing to our email list or following us on our social media profiles linkedin facebook twitter google and youtube . more ... press releases 09 12 16 amkor announces appointment of new chief financial officer 09 12 16 qualcomm opens qualcomm communication technologies in shanghai for semiconductor test manufacturing 08 31 16 amkor technology to present at upcoming conferences 08 01 16 amkor technology reports financial results for the second quarter 2016 more ... data sheets datasheet type select datasheet upcoming events 10 18 16 iwplc 2016 10 21 16 semi arizona breakfast forum the age of automotive electronics 10 25 16 semicon europa 2016 10 26 16 globalfoundries technology conference shanghai 11 08 16 ic china 2016 recent site updates chip on chip possum technology data sheet sot 23 tsot data sheet so8 fl data sheet 2016 product line card july update amkor article in csr may june issue what is driving advanced packaging platforms development technical article amkor article in csr march april issue the internet of things and mems packaging technical article swift technology sheet slim technology sheet sip technology solution data sheet wlcsp data sheet stacked csp scsp data sheet copyright 2003 2016 amkor technology 2045 east innovation circle tempe az 85284 480 821 5000 privacy policy legal