epoxy adhesives
devcon 230 14270 2 oz . mark 5 5 minute epoxy
rapid curing general purpose adhesive encapsulant packing type dev pak color light amber gap fill 1 4 adhesive tensile shear 1400 psi viscosity 10000 0 cp hardness 85 0 shore d temp range 40 0 & 176 ; f min 200 0 & 176 ; f max fix cure time temp 1 h 75 & 176 ; f full cure time temp 16 min 75 & 176 ; f chemical compound epoxy dielectric strength 490 0 v mil applications multi purpose applicable materials most metals fabric ceramic glass concrete wood resistance kerosene sulfuric acid 10 % toluene hydrochloric acid 3 % sku orsno62355
devcon