interconnect terminals
integrated interconnect technologies for 3d nanoelectronic systems
book information todays microchips have nearly reached their performance limits . various heat removal power delivery chip reliability and input output i o signaling problems stand in the way of next generation 3d gigascale system on a chip technology and this cutting edge guide describes the latest breakthroughs in microfluidics high density compliant electrical interconnects and nanophotonics that are converging to solve them . engineers get full details on state of the art i o interconnects and packaging along with the latest advances and applications in power delivery design analysis and modeling . the book explores interconnect structures materials and packages for achieving high bandwidth off chip electrical communication . it brings readers up to speed with the latest heat removal technologies including chip scale microchannel cooling integrated micropumps and fluidic channels and carbon nanotube interconnects .