Shubhendu S. Mukherjee, Christoper Weaver, Joel Emer, Steven K. Reinhardt, and Todd Austin, "Measuring Architectural Vulnerability Factors," Top picks of 2003 in IEEE Micro, Nov/Dec 2003. IEEE Xplore link |
Focus
Energy consumption
Power dissipation
Power delivery
Later
Stuck at faults, single-event upsets (cosmic rays, 8% increase over generation)
device degradation
Cause of variations
random dopant variations (in channel > threshold variations)
sub-wavelength lithography
heat flux (dynamic variation)
tolerant design
leakage invp speed (body bias to control)
freq + active/leakage power distribution > synopsys
deterministic to probabilistic /statistic
burn in > high voltage, high temp for short periods just after the chips are manufactured to accelerate aging > faults can be caught fast
synthesis :
design (multivariate for) perf, active and leakage power, reliability, yield and bin splits.
Physical :
Razor
Arch :
Reliability and security engine
small checker hardware
resilient hardware > multicore redundant